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Digi ConnectCore 8M Mini


Embedded system-on-module based on the NXP i.MX 8M Mini processor with built-in Video Processing Unit (VPU); designed for longevity and scalability in industrial IoT applications.

  • Industrial i.MX 8M Mini quad-core system-on-module
  • Digi SMTplus® form factor (40 mm x 45 mm) for ultimate reliability and design freedom
  • Power management with both hardware and software support for low-power designs
  • Display and camera capabilities with graphics and video hardware acceleration
  • Video capabilities with built-in VPU
  • Pre-certified dual-band 802.11a/b/g/n/ac and Bluetooth® 5 connectivity
  • Seamless cellular modem and Digi XBee® wireless integration
  • Cloud and edge-compute services integration
  • Built-in device security, identity and privacy with Digi TrustFence® and a hardware Secure Element
  • Remote monitoring and management with Digi Remote Manager®
  • Yocto Project Linux and Android support
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Digi ConnectCore® 8M Mini, based on the NXP® i.MX 8M Mini application processor, is a secure integrated system-on-module (SOM) platform. The Mini is designed for a wide range of industrial, medical, agricultural and transportation applications, including Internet of Things (IoT), human machine interface (HMI), equipment monitoring, audio/voice, graphics/video, edge computing and machine learning.

Digi ConnectCore 8M Mini features four power-efficient Arm® Cortex®-A53 cores, one Cortex-M4 core, and the Digi Microcontroller Assist Cortex-M0, which allow it to minimize power consumption while maintaining a high standard of performance. With a 10+ year product lifecycle, OEMs can reduce their development costs and achieve a lower total cost of ownership by leveraging pre-certified wireless connectivity, remote management, cloud integration, and complete Linux Yocto Project and Android software platform support.

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Digi ConnectCore 8M Mini

Digi ConnectCore 8M Mini

The most complete i.MX 8M Mini development kit is available

The Digi ConnectCore 8M Mini is an embedded system on module (SOM) that supports rapid product development with complete open-source and scalable embedded software development tools, pre-certified wireless connectivity, cloud integration and built-in security. Launch your next product design with Digi ConnectCore 8M Nano.

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SPECIFICATIONS Digi ConnectCore® 8M Mini
  • Four Cortex®-A53 cores @ 1.6 GHz
  • Cortex-M4 400 MHz core processor for low-power processing
MEMORY Up to 8 GB eMMC, up to 2 GB of LPDDR4 (32-bit)
GRAPHICS Graphic Processing Unit:
  • GCNanoUltra for 3D acceleration
  • GC320 for 2D acceleration
  • LCDIF display controller, supporting up to 1080 p 60 fps display through MIPI DSI
  • 4-lane MIPI DSI interface
  • 4-lane MIPI CSI interface
Video Processing Unit:
  • 1080 p 60 HEVC H.265 (decode)
  • VP9, H.264, VP8 (encode/decode)
SECURITY Digi TrustFence®, TRNG, TrustZone, Secure RTC, Secure JTAG, Secure Element
  • 1x PCI Express 2.0. (PCIe)
  • 2x USB 2.0 OTG controllers with integrated PHY interfaces
  • 3x Ultra Secure Digital Host Controller (uSDHC) interfaces
  • 5x Universal Asynchronous Receiver / Transmitter (UART) modules
  • 4x I2C modules
  • 3x SPI modules
  • 1x Quad SPI
  • 10x PWM channels
  • 1x 16-bit ADC module with accurate internal voltage reference, up to 20 channels
  • 5x Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, codec/DSP and DSD interfaces
  • 1x S/PDIF input and output, including a raw capture input mode
  • 8-channel Pulse Density Modulation (PDM) input
  • Up to 112 GPIOs
ETHERNET 10/100/1000M Ethernet + AVB
WI-FI 802.11a/b/g/n/ac dual-band wireless
BLUETOOTH Bluetooth® 5
  • Independent Cortex-M0+ microcontroller subsystem
  • Supporting ultra-low power modes @ <3µA
OPERATING TEMPERATURE Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design
STORAGE TEMPERATURE -50° C to 125° C (-58° F to 257° F)
RELATIVE HUMIDITY 5% to 90% (non-condensing)
RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS/ IMMUNITY/ SAFETY FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548; FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)
DESIGN VERIFICATION Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS 118 castellated vias, LGA-474, 1.27 mm pitch,
40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)

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